Chip Gallery
IC for EMI analysis of Wafer-Level Package
[reference paper] Jung Hoon Cho, Sangyeong Jeong, Jun-Bae Kim, Jeong Don Ihm, and Jingook Kim, “Prediction and Analysis of Radiated EMI from a Wafer-Level Package based on IC Source Modeling”, IEEE Transactions on Electromagnetic Compatibility, vol. 66, no. 1, pp. 281-292, Feb 2024.
– Used for analysis and measurement of EMI from Wafer-Level Package
– Fabricated with TSMC MPW (180nm BCD process), 2022.
Electromagnetic Interference management IC (EMIC)
[reference paper] Sangyeong Jeong and Jingook Kim, “One-Chip Active EMI Filter with Integrated Buck Converter and Self-Malfunction Detection for CE Noise Reduction”, IEEE Transactions on Power Electronics, vol. 38, no. 11, pp. 13977 – 13987, Nov 2023.
– One-chip AEF IC + PMIC
– Fabricated with TSMC MPW (180nm BCD process), 2021.
Oscilloscope IC
[reference paper] Zakirbek Mamatair Uulu, Jung Hoon Cho, Bumhee Bae, and Jingook Kim, “A Proposed On-die Oscilloscope for Monitoring of Power Noise waveform inside IC due to Transient Stress Events”, IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 2, pp. 429-442, April 2022.
– World-First oscilloscope IC for on-system diagnosis
– Fabricated with TSMC MPW (180nm CMOS process), 2020.
Active EMI filter IC
[reference paper] Sangyeong Jeong, Junsik Park, Jingook Kim, “A Customized Integrated Circuit for Active EMI Filter with High Reliability and Scalability”, IEEE Transactions on Power Electronics, vol. 36, no. 11, pp. 12631-12645, Nov. 2021.
– World-First IC for active EMI filter
– Fabricated with TSMC MPW (180nm BCD process), 2019.
IC for measurement and analysis of ESD noise effects (2)
[reference paper] Myeongjo Jeong, Minchul Shin, Jinwoo Kim, Manho Seung, Seokkiu Lee, and Jingook Kim, “Measurement and Analysis of System-level ESD-Induced Jitter in a Delay-locked Loop”, IEEE Transactions on Electromagnetic Compatibility, vol. 62, no. 5, pp. 1840-1851, Oct 2020.
– Used for malfunction tests of Delay-Locked-Loop due to ESD noises
– Fabricated with M/H MPW (180nm CMOS process), 2016.
IC for measurement and analysis of ESD noise effects (1)
[reference paper] Myungjoon Park, Junsik Park, Joungcheul Choi, Jinwoo Kim, Seonghoon Jeong, Manho Seung, Seokkiu Lee and Jingook Kim, “Measurement and Analysis of Statistical IC Operation Errors in a Memory Module due to System-Level ESD Noise”, IEEE Transactions on Electromagnetic Compatibility, vol. 61, no. 1, pp. 29-39, Feb 2019.
– Used for malfunction tests of F/F register due to ESD noises
– Fabricated with M/H MPW (180nm CMOS process), 2015.
IC for power&signal integrity analysis (3)
[reference paper] Jingook Kim, Jongjoo Lee, Eunkyeong Park, and Youngwoo Park, “An Enhanced Statistical Analysis Method for I/O Links Considering Supply Voltage Fluctuations and Inter-Symbol-Interference”, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 5, no. 8, pp. 1129-1141, Aug. 2015.
– Used for modeling of power supply induced jitter of switching buffers
– Fabricated with Dongbu MPW (110nm CMOS process), 2014.
IC for power&signal integrity analysis (2)
[reference paper] Eunkyeong Park, Hyungsoo Kim, Jongjoo Shim, Yongju Kim, Yunsaing Kim, and Jingook Kim, “Analytical Calculation of Jitter Probability Density at Multi-Stage Output Buffers due to Supply Voltage Fluctuations”, IEEE Transactions on Electromagnetic Compatibility, vol. 57, no. 4, pp. 796-806, Aug. 2015.
– Used for analysis and measurement of power supply-induced jitter due to switching buffer
– Fabricated with Dongbu MPW (110nm CMOS process), 2014.
IC for power&signal integrity analysis (1)
[reference paper] Jingook Kim, Junho Lee, Sunki Cho, Chulsoon Hwang, Changwook Yoon, and Jun Fan, “Analytical probability density calculation for step pulse response of a single-ended buffer with arbitrary power-supply voltage fluctuations”, IEEE Transactions on Circuits and Systems I, vol. 61, no. 7, pp. 2022-2033, July 2014.
– Used for analysis and measurement of power supply noise due to switching buffer
– Fabricated with Samsung MPW (130nm CMOS process), 2013.