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Professor

JingoJingook_Kim2ok Kim

Tel) +82-52-217-2127
Office) Room #501-7, Building #106 UNIST
E-mail) jingook@unist.ac.kr

 


EDUCATION
· B.S. Electrical Engineering, KAIST, February 2000
· M.S. Electrical Engineering, KAIST, February 2002
· Ph.D. Electrical Engineering, KAIST, August 2006

WORK EXPERIENCE
· Professor (Sep 2020 – Present)
Ulsan National Institute of Science and Technology (UNIST), Ulsan, Korea

· Associate/Assistant Professor (July 2011 – Aug 2020)
Ulsan National Institute of Science and Technology (UNIST), Ulsan, Korea

· Research Assistant Professor / Post-Doctoral Researcher (January 2009 – July 2011)
EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA

· Senior Engineer (June 2006 – December 2008)
DRAM Design Team, Memory Division, Samsung Electronics Co., Korea

· Full-time Internship (April 2003 – February 2004)
Institute of Microelectronics (IME), A-Star, Singapore

HONORS AND AWARDS

· 한국전자파학회 우수연구자상, 2019
· Best Paper Award, IEEE International Symposium on EMC and SI, July 2019, New Orleans, US. (3 papers nominated in the final lists of 13 papers)
· Best Student Paper Award, 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), Dec 2018, Chandigarh, India.
· Best Student Paper Award, 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, June 2017, Seoul, Korea
· Best Student Paper Award, 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility, May 2016, Shenzhen, China
· Best Paper Award, IEEE International Symposium on EMC and SI, March 2015, Santa Clara, US.
· Best Paper Award Finalist, DesignCon 2014, Santa Clara, US.
· Best Paper Award Finalist, DesignCon 2013, Santa Clara, US.
· Best Paper Award, IEEE International EMC Symposium, 2010. (2 papers nominated in the final lists of 8 papers)
· Samsung Scholarship ( November 2004 – June 2006 )
· 2004 Motorola-IEEE/CPMT Graduate Student Fellowship for Research on Electronic Packaging.

PROFESSIONAL ACTIVITIES
· Associate Editor, Journal of Electromagnetic Engineering and Science (2021~)
· Senior Member, IEEE
· Executive Committee Member, Korea EOS/ESD Association
· Member of the IEEE EMC society Technical Committees
· Regular and Speical Session Chair, 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility
· Special Program Chair, IEEE Electrical Design of Advanced Packaging & System(EDAPS) Symposium, Dec 14-16, 2015.
· Publication Chair, IEEE wireless power transfer conference 2014, May 8~9, 2014