Book Chapters

• Chulsoon Hwang, Jingook Kim, Jun Fan, Joungho Kim, and James L. Drewniak, “Modeling of On-Chip Power Distribution Network” in Noise Coupling in System-on-Chip, CRC press, December 15, 2017.

Journals

[64] Kyunghoon Lee, Sangyeong Jeong, Wooshin Choi, Jung-Hwan Choi, and Jingook Kim, “Characterization and Application of Improved Oscilloscope IC for System Diagnosis of ESD and HPEM Effects”, Accepted to IEEE Transactions on Electromagnetic Compatibility.
[63] Byungjin Bae and Jingook Kim, “Quantitative Analysis and Prediction of EMI from Spread Spectrum of Differential Random Signaling based on IC Source Modeling”, Accepted to IEEE Transactions on Electromagnetic Compatibility.
[62] Jung Hoon Cho, Sangyeong Jeong, Jun-Bae Kim, Jeong Don Ihm, and Jingook Kim, “Prediction and Analysis of Radiated EMI from a Wafer-Level Package based on IC Source Modeling”, IEEE Transactions on Electromagnetic Compatibility, vol. 66, no. 1, pp. 281-292, Feb 2024.
[61] Sangyeong Jeong and Jingook Kim, “One-Chip Active EMI Filter with Integrated Buck Converter and Self-Malfunction Detection for CE Noise Reduction”, IEEE Transactions on Power Electronics, vol. 38, no. 11, pp. 13977 – 13987, Nov 2023.
[60] Byungjin Bae, Kyungjin Kwak, Joosung Hwang, Euihyuk Kim, and Jingook Kim, “Accurate and Efficient Computation of System-Level ESD Noise Waveforms in ISO 10605 Standard Using Decomposition Method and Split-Domain Approach”, IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 6, pp. 1847-1858, Dec 2022.
[59] Kyungjin Kwak, Hwansoo Moon, Cheolhan Kim and Jingook Kim, “Efficient Computation of Electromagnetic Coupling from Various Types of Antennas Based on Reciprocity Theorem”, IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 6, pp. 1915-1926, Dec 2022.
[58] Joon Ki Paek, Kyunghoon Lee, and Jingook Kim, “Detection Circuits for System-Level Signal and Power Noises due to High-Power Electromagnetic Pulses”, IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 4, pp. 1206-1218, Aug. 2022.
[57] Zakirbek Mamatair Uulu, Jung Hoon Cho, Bumhee Bae, and Jingook Kim, “A Proposed On-die Oscilloscope for Monitoring of Power Noise waveform inside IC due to Transient Stress Events”, IEEE Transactions on Electromagnetic Compatibility, vol. 64, no. 2, pp. 429-442, April 2022.
[56] Sangyeong Jeong, Junsik Park, Jingook Kim, “A Customized Integrated Circuit for Active EMI Filter with High Reliability and Scalability”, IEEE Transactions on Power Electronics, vol. 36, no. 11, pp. 12631-12645, Nov. 2021.
[55] Manje Yea, Jingook Kim, and Ki Jin Han, “Frequency-Dependent Bearing Voltage Model for Squirrel-Cage Induction Motors”, IEEE Transactions on Industrial Electronics, vol. 69, no. 5, pp. 5071-5080, May 2022.
[54] Junsik Park, Wooryong Lee, Namsu Kim, Bonggyu Kang, Chunghyun Ryu, Jongsung Lee, Cheolgu Jo, and Jingook Kim, “Field Source Extraction of an ESD Generator and Its Application to System-Level ESD Analysis in a Solid-State Storage System”, Journal of Electromagnetic Waves and Applications, vol. 35, no. 9, pp. 1247-1260, Feb. 2021.
[53] Byungjin Bae and Jingook Kim, “A Low-Voltage Microwave Plasma Ionizer with Reduced Electric Overstress Due to Displacement Current Coupling from a High-AC Voltage Source”, IEEE Transactions on Electromagnetic Compatibility, vol. 63, no. 5, pp. 1501-1511, Oct. 2021.
[52] Younggon Ryu, Manje Yea, Jingook Kim, Ki Jin Han, “Stator Impedance Modeling Platform for the EMC-Aware Design of 3.7- to 7.5-kW Squirrel-Cage Induction Motors”, IEEE Transactions on Industrial Electronics, vol. 68, no. 11, pp. 11255-11265, Nov. 2021.
[51] Shubhankar Marathe, Abhishek Patnaik, Member, Rui Mi, Kaustav Ghosh, Jingook Kim, David Pommerenke, and Daryl G. Beetner, “Measurement-based Validation of Integrated Circuit Transient Electromagnetic Event Sensors”, IEEE Transactions on Electromagnetic Compatibility, vol. 62, no. 4, pp. 1555-1562, Aug 2020.
[50] Byungjin Bae, Jingook Kim, and Ki Jin Han, “Numerical Verification of Dielectric Contactor as Auxiliary Loads for Measuring the Multi-Port Network Parameter of Vertical Interconnection Array”, IEEE Access, vol. 8, pp. 117997-118004, July 2020.
[49] Yin Sun, Jingook Kim, Muqi Ouyang, and Chulsoon Hwang, “Improved Target Impedance Concept with Jitter Specification”, IEEE Transactions on Electromagnetic Compatibility, vol. 62, no. 4, pp. 1534-1545, Aug 2020.
[48] Kyungjin Kwak, Tae-il Bae, Kichul Hong, Hyungsoo Kim, and Jingook Kim, “Accuracy investigation of equivalent dipole arrays for near-field estimation in presence of shielding or dielectric structures”, Microwave and Optical Technology Letter, vol. 62, no. 4, pp. 1724-1732, Apr 2020.
[47] Sangyeong Jeong, Kyungjin Kwak, Gwigeun Park, Youngjin Baek, Dongmin Park, and Jingook Kim, “A Proposed Terminal-Ground EMI Filter for Reduction of Conducted Emissions Considering Cable Radiation and Safety”, IEEE Transactions on Electromagnetic Compatibility, vol. 61, no. 6, pp. 1926-1934, Dec 2019.
[46] Myeongjo Jeong, Minchul Shin, Jinwoo Kim, Manho Seung, Seokkiu Lee, and Jingook Kim, “Measurement and Analysis of System-level ESD-Induced Jitter in a Delay-locked Loop”, IEEE Transactions on Electromagnetic Compatibility, vol. 62, no. 5, pp. 1840-1851, Oct 2020.
[45] Dongil Shin, Sangyeong Jeong, Youngjin Baek, Chansoo Park, Gwigeun Park, and Jingook Kim, “A Balanced Feedforward Current-Sense Current-Compensation Active EMI Filter for Common-Mode Noise Reduction”, IEEE Transactions on Electromagnetic Compatibility, vol. 62, no 2, pp. 386-397, Apr 2020.
[44] Junsik Park, Jongsung Lee, Cheolgu Jo, Byongsu Seol, and Jingook Kim, “A Cost-Effective Structure for Secondary Discharge Control to Improve System-Level ESD Immunity of a Mobile Product”, IEEE Transactions on Electromagnetic Compatibility, vol. 62, no. 1, pp. 285-290, Feb 2020.
[43] Wooryong Lee and Jingook Kim, “Accuracy Investigation of a Neuromorphic Machine Learning System due to Electromagnetic Noises using PEEC Model”, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol 9, no. 10, pp. 2066-2078, Oct. 2019.
[42] Hwa-Pyeong Park, Sangyeong Jeong, Mina Kim, Jingook Kim, and Jee-Hoon Jung, “Spread Spectrum Technique for Decreasing EM Noise in High Frequency APWM HB Resonant Converter with Reduced EMI Filter Size”, IEEE Transactions on Power Electronics, vol. 34, no. 11, pp. 10845-10855, Nov. 2019.
[41] Sangyeong Jeong, Dongil Shin, and Jingook Kim, “A Transformer-Isolated Common-Mode Active EMI Filter without Additional Components on Power Lines”, IEEE Transactions on Power Electronics, vol. 34, no. 3, pp. 2244-2257, Mar 2019.
[40] Myungjoon Park, Junsik Park, Joungcheul Choi, Jinwoo Kim, Seonghoon Jeong, Manho Seung, Seokkiu Lee and Jingook Kim, “Measurement and Analysis of Statistical IC Operation Errors in a Memory Module due to System-Level ESD Noise”, IEEE Transactions on Electromagnetic Compatibility, vol. 61, no. 1, pp. 29-39, Feb 2019.
[39] Heegon Kim, Jingook Kim, Jun Fan, and Chulsoon Hwang, “Precise Analytical Model of Power Supply Induced Jitter (PSIJ) Transfer Function at Inverter Chains”, IEEE Transactions on Electromagnetic Compatibility, vol. 60, no. 5, pp. 1491-1499, Oct 2018.
[38] Dongil Shin, Sangyeong Jeong, and Jingook Kim, “Quantified Design Guidelines of Compact Transformer -less Active EMI Filter for Performance, Stability, and High Voltage Immunity”, IEEE Transactions on Power Electronics, vol. 33, no. 8, pp. 6723-6737, Aug. 2018.
[37] Kyungjin Kwak, Jaehyuk Kim, and Jingook Kim, “Near-Field Validation of Dipole-Moment Model Extracted from GTEM Cell Measurements and Application to a Real Application Processor”, IEEE Transactions on Electromagnetic Compatibility, vol. 60, no. 2, pp. 423-434, Apr. 2018.
[36] Junsik Park, Jongsung Lee, Cheolgu Jo, Byongsu Seol, and Jingook Kim, “IC Failure Analysis due to Charged Board Events by Measurements and Modeling of Discharging Currents through IC Pins”, IEEE Transactions on Device and Materials Reliability, vol. 17, no. 4, pp. 624-635, Dec. 2017.
[35] Ketan Shringarpure, Siming Pan, Jingook Kim, Jun Fan, Brice Achkir, Bruce Archambeault, and James L. Drewniak, “Sensitivity Analysis of Circuit Model for Power Distribution Network in a Multi-Layered Printed Circuit Board”, IEEE Transactions on Electromagnetic Compatibility, vol. 59, no. 6, pp. 1993-2001, Dec. 2017.
[34] Sangyeong Jeong, Mina Kim, Jee-Hoon Jung and Jingook Kim, “An Effective Experimental Optimization Method for Wireless Power Transfer System Design using Frequency Domain Measurement”, Journal of Electromagnetic Engineering and Science, vol. 17, no. 4, pp. 208-220, Oct. 2017.
[33] Changwook Yoon, Jingook Kim, Sukjin Kim, Kiyeong Kim, Joungho Kim, Heegon Kim, Jun Fan, “A slope and amplitude controllable triangular-current generator for the injection of a broad-band PDN noise”, IEEE Electromagnetic Compatibility Magazine, vol. 5, no. 4, pp. 112-116, 2017.
[32] Dongil Shin, Namsu Kim, Jongjoo Lee, Youngwoo Park, and Jingook Kim, “Quantified Design Guides for Reduction of Radiated Emissions in Package-level Power Distribution Networks”, IEEE Transactions on Electromagnetic Compatibility, vol. 59, no. 2, pp. 468-480, Apr. 2017.
[31] Junsik Park, Jongsung Lee, Byongsu Seol, and Jingook Kim, “Fast and Accurate Calculation of System-Level ESD Noise Coupling to a Signal Trace by PEEC Model Decomposition”, IEEE Transactions on Microwave Theory and Techniques, vol. 65, no. 1, pp. 50-61, Jan. 2017.
[30] Jingook Kim, “Statistical Analysis for Pattern-Dependent Simultaneous Switching Outputs (SSO) of Parallel Single-Ended Buffers”, IEEE Transactions on Circuits and Systems 1, vol. 64, no.1, pp. 156- 169, Jan 2017.
[29] Jongwoo Jeong, Jingook Kim, No-Weon Kang, and Ki Jin Han, “High-Frequency Testing of Vertical Interconnection Array Using Indirect Contact Probing Method With an Improved Calibration”, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 6, no. 11, pp. 1638-1647, Nov. 2016.
[28] Ketan Shringarpure, Siming Pan, Jingook Kim, Jun Fan, Brice Achkir, Bruce Archambeault, James Drewniak, “Formulation and Network Model Reduction for Analysis of the Power Distribution Network in a Production Level Multilayered Printed Circuit Board”, IEEE Transactions on Electromagnetic Compatibility, vol. 58, no. 3, pp. 849-858, June 2016.
[27] Jingook Kim, Jongjoo Lee, Eunkyeong Park, and Youngwoo Park, “An Enhanced Statistical Analysis Method for I/O Links Considering Supply Voltage Fluctuations and Inter-Symbol-Interference”, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 5, no. 8, pp. 1129-1141, Aug. 2015.
[26] Junsik Park, Jongsung Lee, Byongsu Seol, and Jingook Kim, “Efficient Calculation of Inductive and Capacitive Coupling due to Electrostatic Discharge (ESD) Using PEEC Method”, IEEE Transactions on Electromagnetic Compatibility, vol. 57, no. 4, pp. 743-753, Aug. 2015.
[25] Dongil Shin, Sungnam Kim, Geunseok Jeong, Jaesu Park, Joungwook Park, Ki Jin Han, and Jingook Kim, “Analysis and Design Guide of Active EMI Filter in a Compact Package for Reduction of Common-Mode Conducted Emissions”, IEEE Transactions on Electromagnetic Compatibility, vol. 57, no. 4, pp. 660-671, Aug. 2015.
[24] Eunkyeong Park, Hyungsoo Kim, Jongjoo Shim, Yongju Kim, Yunsaing Kim, and Jingook Kim, “Analytical Calculation of Jitter Probability Density at Multi-Stage Output Buffers due to Supply Voltage Fluctuations”, IEEE Transactions on Electromagnetic Compatibility, vol. 57, no. 4, pp. 796-806, Aug. 2015.
[23] Changwook Yoon, Mikheil Tsiklauri, Mikhail Zvonkin, Qinghua Bill Chen, Alexander Razmadze, Aman Aflaki, Jingook Kim, Jun Fan, and James L. Drewniak, “Design Criteria and Error Sensitivity of Time-Domain Channel Characterization (TCC) for Asymmetry Fixture De-Embedding”, IEEE Transactions on Electromagnetic Compatibility, vol. 57, no. 4, pp. 836-846, Aug. 2015.
[22] Younggon Ryu, Sungnam Kim, Genseok Jeong, Jaesu Park, Duil Kim, Jongwook Park, Jingook Kim, Ki Jin Han, “Common mode noise reduction for an LLC resonant converter by using passive noise cancellation,” Journal of Electromagnetic Engineering and Science, vol. 15, no. 2, pp. 89-96, Apr. 2015.
[21] Jongwoo Jeong, Jingook Kim, No-Weon Kang, and Ki Jin Han, “Indirect contact probing method for characterizing vertical interconnections in electronic packaging”, IEEE Microwave and Wireless Components Letters, vol. 25, no. 1, pp. 70-72, Jan. 2015.
[20] Jingook Kim, Jongjoo Lee, Seungyoung Ahn, and Jun Fan, “Closed-form expressions for the noise voltage caused by a burst train of IC switching currents on a power distribution network”, IEEE Transactions on Electromagnetic Compatibility, vol. 56, no. 6, pp.1585-1597, Dec 2014.
[19] Jingook Kim, Junho Lee, Sunki Cho, Chulsoon Hwang, Changwook Yoon, and Jun Fan, “Analytical probability density calculation for step pulse response of a single-ended buffer with arbitrary power-supply voltage fluctuations”, IEEE Transactions on Circuits and Systems I, vol. 61, no. 7, pp. 2022-2033, July 2014.
[18] Seonghwan Kim, Hyun Ho Park, Jonghoon Kim, Jingook Kim, Seungyoung Ahn, “Design and Analysis of a Resonant Reactive Shield for a Wireless Power Electric Vehicle”, IEEE Transactions on Mircrowave Theory and Techniques, vol. 62, no. 4, pp. 1057-1066, April 2014.
[17] Hanfeng Wang, Siming Pan, Jingook Kim, Albert E. Ruehli, and Jun Fan, “Capacitance Calculation for Via Structures Using an Integral Equation Method Based on Partial Capacitance”, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 3, no. 12, pp. 2134-2146, Dec. 2013.
[16] Jingook Kim, Yuzo Takita, Kenji Araki, and Jun Fan, “Improved Target Impedance for Power Distribution Network Design with Power Traces Based on Rigorous Transient Analysis in a Handheld Device”, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 3, no. 9, pp. 1554-1563, Sep. 2013.
[15] Chulsoon Hwang, Jingook Kim, Brice Achkir, and Jun Fan, “Analytical Transfer Functions relating Power and Ground Voltage Fluctuations to Jitter at a Single-Ended Full-Swing Buffer”, IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 3, no. 1, pp. 113-125, Jan. 2013.
[14] Jingook Kim, Liang Li, Songping Wu, Hanfeng Wang, Yuzo Takita, Hayato Takeuchi, Kenji Araki, Jun Fan, and James L. Drewniak, “Closed-form expressions for the maximum transient noise voltage caused by an IC switching current on a power distribution network”, IEEE Transactions on Electromagnetic Compatibility, vol. 54, no. 5, pp. 1112-1124, Oct. 2012.
[13] Jingook Kim, Jun Fan, Albert Ruehli, Joungho Kim, and James L. Drewniak, “Inductance calculation for plane-pair area fills with vias in a power distribution network using a cavity model and partial inductances”, IEEE Transactions on Microwave Theory and Techniques, vol. 59, no. 8, pp. 1909-1924, Aug. 2011.

—–  ICEMC Lab. Started ——

[12] Jingook Kim, Ketan Shringarpure, Jun Fan, Joungho Kim, and James L. Drewniak, “Equivalent circuit model for power bus design in multi-layer PCBs with vias arrays”, IEEE Microwave and Wireless Components Letters, vol.21, no. 2, pp.62-64, Feb. 2011.
[11] Tae-Young Oh, Young-Soo Sohn, Seung-Jun Bae, Min-Sang Park, Ji-Hoon Lim, Yong-Ki Cho, Dae-Hyun Kim, Dong-Min Kim, Hye-Ran Kim, Hyun-Joong Kim, Jin-Hyun Kim, Jin-Kook Kim, Young-Sik Kim, Byeong-Cheol Kim, Sang-Hyup Kwak, Jae-Hyung Lee, Jae-Young Lee, Chang-Ho Shin, Yunseok Yang, Beom-Sig Cho, Sam-Young Bang, Hyang-Ja Yang, Young-Ryeol Choi, Gil-Shin Moon, Cheol-Goo Park, Seok-Won Hwang, Jeong-Don Lim, Kwang-Il Park, Joo Sun Choi, and Young-Hyun Jun, “A 7 Gb/s/pin 1 Gbit GDDR5 SDRAM with 2.5 ns bank to bank active time and no bank group restriction”, IEEE Journal of Solid-State Circuits, vol. 46, no. 1, pp. 107-118, Jan 2011.
[10] Jingook Kim, Leihui Ren, and Jun Fan, “Physics-based inductance extraction for via arrays in parallel planes for power distribution network design”, IEEE Transactions on Microwave Theory and Techniques, vol. 58, pp. 2434-2447, September 2010.
[9] Jun Fan, Xiaoning Ye, Jingook Kim, Bruce Archambeault, and Antonio Orlandi “Signal integrity design for high-speed digital circuits: progress and directions”, IEEE Transactions on Electromagnetic Compatibility, vol. 52, no. 2, pp. 392-400, May 2010.
[8] Jaemin Kim, Youchul Jeong, Jingook Kim, Junho Lee, Chunghyun Ryu, Jongjoo Shim, Minchul Shin, Joungho Kim, “Modeling and measurement of inter-level electromagnetic coupling and fringing effect in a hierarchical power distribution network using segmentation method with resonant cavity model”, IEEE Transactions on Advanced Packaging, vol.31, pp. 544-557, Aug 2008.
[7] Jingook Kim, Youchul Jeong, Jaemin Kim, and Joungho Kim, “Hybrid analytical modeling of noise coupling to signal traces in a power bus with embedded film capacitor”, IEEE Microwave and Wireless Components Letters, vol.16, pp.534-536, October 2006.
[6] Jongbae Park, Hyungsoo Kim, Youchul Jeong, Jingook Kim, Jun So Pak, Dong Gun Kam, and Joungho Kim, “Modeling and measurement of simultaneous switching noise coupling through signal via transition,” IEEE Transactions on Advanced Packaging, vol.29, pp.548-559, Aug 2006.
[5] Jingook Kim, Mihai Dragos Rotaru, Seungyong Baek, Jongbae Park, Mahadevan K. Iyer, and Joungho Kim, “Analysis of noise coupling from a power distribution network to signal traces in a high-speed multilayer printed circuit board”, IEEE Transactions on Electromagnetic Compatibility, vol. 48, pp. 319-330, May 2006.
[4] Jingook Kim, Heeseok Lee, and Joungho Kim, “Effect on signal integrity and radiated emission by split ground plane on high-speed multi-layer PCB”, IEEE Transactions on Advanced Packaging, vol.28, pp. 724-735, Nov. 2005.
[3] Seungyong Baek, Jingook Kim, and Joungho Kim, “ Modeling and measurement of mode-conversion and frequency dependent loss in high-speed differential interconnections on multilayer PCB, IEICE Transaction on Electronics, vol. E88-C, No. 10, October 2005.
[2] Junwoo Lee, Woonghwan Ryu, Jingook Kim, Junho Lee, Namhoon Kim, Junso Pak, Jae Myun Kim, and Joungho Kim, “Microwave frequency interconnection line model of a wafer level package,” IEEE Trans. on Advanced Packaging, vol. 25, pp.356-364, August 2002.
[1] Jongjoo Lee, Jingook Kim, Sungkyu Yu and Joungho Kim, “Picosecond time-domain characterization of CPW bends using a photoconductive near-field mapping probe,” IEEE Microwave and Wireless Components Letters, vol.11, pp. 453-455, Nov. 2001.