[reference paper] Jung Hoon Cho, Sangyeong Jeong, Jun-Bae Kim, Jeong Don Ihm, and Jingook Kim, “Prediction and Analysis of Radiated EMI from a Wafer-Level Package based on IC Source Modeling”, IEEE Transactions on Electromagnetic Compatibility, vol. 66, no. 1, pp. 281-292, Feb 2024.

– Used for analysis and measurement of EMI from Wafer-Level Package

– Fabricated with TSMC MPW (180nm BCD process), 2022.