[97] Dongwan Kang, Sangyeong Jeong, Hyck Su Kweon, Young Hwan Kwack, Jingook Kim, “Extraction of Noise Source Impedance of an operating high-power converter with high-EMI noises by increasing SNR using an amplifier”, EMC Europe 2024, Sep 2024.
[96] Hyunwoo Yu, Sangyeong Jeong, Jingook Kim,  “Unsupervised Anomaly Detection of a Home Appliance by Monitoring EMI Data”, 2024 IEEE international symposium on Electromagnetic Compatibility, signal & power integrity, Aug 2024.
[95]  Jun-Bae Kim, Chang Ki Kwon, Taeho Kim, Sangwook Park, Yoo-Chang Sung, Jeong Don Ihm, Seung-Jun Bae, Jingook Kim, “Near-Field EMI Analysis of LPDDR5 DRAM at idle mode”, 2023 IEEE international symposium on Electromagnetic Compatibility, signal & power integrity, Aug 2023.
[94] Lalit Kumar Baghel, Suman Kumar, Seyit Ahmet Sis, Jingook Kim, “Crosstalk Reduction in Coupled Microstrip Lines using TT-shaped DMS Approach”, 2023 Joint Asia-Pacific International Symposium on Electromagnetic Compatibility, May 2023.
[93] Jingook Kim, Sangyeong Jeong, Jun-Bae Kim and Jeong Don Ihm, “Automatic SPICE-Integrated Reinforcement Learning for Decap Optimization for EMI and Power Integrity”, 2022 IEEE international symposium on Electromagnetic Compatibility, signal & power integrity, Aug 2022.
[92] Jun-Bae Kim, Chang Ki Kwon, Sangwook Park, Yoo-Chang Sung, Jeong Don Ihm, Wooil Kim, Jungho Jin, Sangjoon Hwang, Changsik Yoo, and Jung-Hwan Choi, Jingook Kim, “Low EMI characteristic of LPDDR5 SDRAM with Edge- placed PADs and Short Re-Distribution Lines”, 2022 IEEE international symposium on Electromagnetic Compatibility, signal & power integrity, Aug 2022.
[91] Byungjin Bae, Jeong Hwang, Cheol-Han Kim, Hwan-Soo Moon, and Jingook Kim, “Proposed ESD Models of Dust Cleaners and Analysis of ESD Failures in Automotive Headlamps”, 2021 EOS/ESD Symposium, Sep 2021.
[90] Byungjin Bae, Hyun Yoon, Ho-Jong Hwang, and Jingook Kim, “A Low-Voltage Microwave Plasma Ionizer Without Reduced Ionizing Performance Due to Particle Fuzzballs”, 2021 EOS/ESD Symposium, Sep 2021.
[89] Chanjong Lee, Sangyeong Jeong, Jun-Bae Kim, Jeong Don Ihm, Jingook Kim, “Optimization of PDN decoupling capacitors for EMI Reduction based on Deep Reinforcement Learning”,  2021 IEEE international symposium on Electromagnetic Compatibility, signal & power integrity, July 2021. (Best Student Paper Finalist)
[88] Muqi Ouyang, Yin Sun, Jongjoo Lee, Jingook Kim, Chulsoon Hwang, “Mechanism Analysis on Radio Frequency Radiation in IC/Package with Bonding Wires”,  2020 IEEE international symposium on Electromagnetic Compatibility, signal & power integrity, July 2020.
[87] Byoungjin Bae, Jingook Kim, “A Low-Voltage Microwave Plasma Ionizer without the ESD Risk due to a High Voltage Source”, 2019 EOS/ESD Symposium, Riverside, CA, USA, Sep 2019.
[86] Sangyeong Jeong and Jingook Kim, “Improvement of Surge Immunity by Using Transformer-isolation in an Active EMI Filter”, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, New Orleans, USA, July 2019.
[85] Wooryong Lee, Junsik Park, Chunghyun Ryu, Jongsung Lee, Bonggyu Kang, Bumhee Bae, and Jingook Kim, “An On-die Oscilloscope for System-Level ESD Noise Monitoring”, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, New Orleans, USA, July 2019. (Best Paper Award Finalist)
[84] Shubhankar Marathe, Abhishek Patnaik, Kaustav Ghosh, Jingook Kim, David Pommerenke, and Daryl G. Beetner, “Experimental Validation of an Integrated Circuit Transient Electromagnetic Event Sensor”, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, New Orleans, USA, July 2019. (Best Paper Award Finalist)
[83] Yin Sun, Jingook Kim, Chulsoon Hwang, “Jitter-Aware Target Impedance”, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, New Orleans, USA, July 2019. (Best Paper Award)
[82] Hwa-Pyeong Park, Sangyeong Jeong, Mina Kim, Jingook Kim, and Jee-Hoon Jung, “APWM Resonant Converter with SST for EMI Filter Size Reduction”, International Conference on Power Electronics-ECCE Asia (ICPE 2019-ECCE Asia), Busan, Korea, May 2019.
[81] Sangyeong Jeong, Dongil Shin, and Jingook Kim, “A Transformer-Isolated Common-Mode Active EMI Filter Using a Low-cost BJT Amplifier with Feedforward Structure”, International Conference on Power Electronics-ECCE Asia (ICPE 2019-ECCE Asia), Busan, Korea, May 2019.
[80] Manje Yea, Younggon Ryu, Jingook Kim, Ki Jin Han, “High-Frequency Analysis and Measurement Techniques with Mixed-Mode Conversion of Induction Motors for Shaft-Voltage Prediction”, International Electric Machines & Drives Conference, CA, USA, May, 2019.
[79] Kyungjin Kwak, Tae-il Bae, Kichul Hong, Hyungsoo Kim, and Jingook Kim, “Comparison and Application of Two Approaches Extracting Equivalent Dipole Arrays of an IC from Measured Near-Field Magnitude Data”, 2018 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), Chandigarh, India, Dec 2018. (Best Student Paper Award)
[78] Myeongjo Jeong, Junsik Park, Jinwoo Kim, Manho Seung, Seokkiu Lee, Jingook Kim, “Measurement and Analysis of System-level ESD-induced Soft Failures of a Sense Amplifier Flip-Flop with Pseudo Differential Inputs”, 2018 EOS/ESD Symposium, Reno NV, USA, Sep. 2018.
[77] Junsik Park, Jongsung Lee, Cheolgu Jo, Byongsu Seol, Jingook Kim, “A Proto-type ESD Generator for System Immunity Test of Wearable Devices”, 2018 EOS/ESD Symposium, Reno NV, USA, Sep. 2018.
[76] Sangyeong Jeong,Youngjin Baek, Wonwoo Lee, Gwigeun Park, and Jingook Kim, “A Terminal Ground Filter between Cable and Chassis for Reduction of Conducted Emissions at a Home Appliance”, 2018 IEEE Symposium on Electromagnetic Compatibility, Signal & Power Integrity, Long Beach, USA, July 2018.
[75] Wooryong Lee, Junsik Park, Jingook Kim, “Electromagnetic Simulations of a Neuromorphic Hardware using PEEC and Memristor SPICE Models”, 2017 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), Hangzhou, China, Dec 2017.
[74] Junsik Park, Jongsung Lee, Cheolgu Jo, Byongsu Seol, Jingook Kim, “System-level ESD Noise induced by Secondary Discharges at Voltage Suppressor Devices in a Mobile Product”, 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, Seoul, Korea, June 2017.
[73] Myungjoon Park, Joungcheul Choi, Jinwoo Kim, Seonghoon Jeong, Manho Seung, Seokkiu Lee and Jingook Kim, “Investigation of the Probe-Factor Deconvolution Methods for Dynamic ESD Fields Measurements”, 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, Seoul, Korea, June 2017.
[72] Sangyeong Jeong, Dongil Shin, Jongpil Kim, Seokjoon Kim and Jingook Kim, “Design of Effective Surge Protection Circuits for an Active EMI Filter”, 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, Seoul, Korea, June 2017. (Best Student Paper Award)
[71] Kyungjin Kwak, Tae-il Bae, Kichul Hong, Hyungsoo Kim, and Jingook Kim, “‘Extraction of Equivalent Array Dipole-Moments Model from only Magnitude Data of Near-Field Scan”, 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, Seoul, Korea, June 2017.
[70] Heegon Kim, Jonghyun Cho, Changwook Yoon, Jingook Kim, Sunkyu Kong, Manho Lee, Sukjin Kim, Brice Achkir, Jun Fan, “Analysis of On-chip Low-Dropout Regulator Induced PDN Noise at High-speed Output Buffer”, DesignCon 2017, Santa Clara, CA, Jan. 2017
[69] Dongil Shin, Changwoo Son, Seonho Jeon, Bongjin Cho, Jinwook Han, and Jingook Kim, “‘A Simple Low-Cost Common Mode Active EMI Filter for 2.2kW Resonant Inverter”, 8th IEEE Energy Conversion Congress & Exposition (ECCE 2016), Milwaukee, WI, USA, Sep 18-22. 2016.
[68] Junsik Park, Jongsung Lee, Seongmoo Kim, Cheolgu Jo, Byongsu Seol, and Jingook Kim, “‘Measurement of Discharging Currents through an IC due to the Charged Board Event Using a Shielded Rogowski Coil”, 2016 EOS/ESD Symposium, Anaheim, CA, USA, Sep 11-16. 2016.
[67] Jaehoon Jeong, Sunghyun Kim, Cheolsoo Kim, and Jingook Kim, “‘Estimation of the Worst-Case Conducted Emission Noise due to Multiple Parallel Power Converters”, 2016 URSI Asia-Pacific Radio Science Conference, Seoul, Korea, Aug. 2016.
[66] Myungjoon Park, Junsik Park, Manho Seung, Joungcheul Choi, Changyeol Lee, Seokkiu Lee, and Jingook Kim, “‘Measurement and Modeling of System-level ESD Noise Voltages in Real Mobile Products”, 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility, Shenzhen, China, May 2016. (Best Student Paper Award)
[65] Kyungjin Kwak, Dongil Shin, Jaehyuk Kim, and Jingook Kim, “Dipole-Moment Model Including Phases for IC Near-Field Analysis Based on GTEM Cell Measurements”, 2016 Asia-Pacific International Symposium on Electromagnetic Compatibility, Shenzhen, China, May 2016.
[64] Jingook Kim, “Analytical Calculation of Pattern-Dependent Simultaneous Switching Outputs (SSO) due to Power Supply Fluctuations”, 2015 IEEE Electrical Design of Advanced Packaging & Systems Symposium, Seoul, Korea, Dec. 2015.
[63] Dongil Shin, Junsik Park, Namsu Kim, Jongjoo Lee, Youngwoo Park, and Jingook Kim, “Efficient Calculation of EMI Factors from Power Distribution Network using Cavity Resonance Circuit Model”, 2015 IEEE Electrical Design of Advanced Packaging & Systems Symposium, Seoul, Korea, Dec. 2015.
[62] Sangyeong Jeong, Booho Jung, Kichul Hong, Hyungsoo Kim, Yun-Saing Kim, and Jingook Kim, “Analytical Calculation of Electromagnetic Fields near Parallel Power Planes with Decoupling Capacitors for RF Interference Estimation”, 2015 IEEE Electrical Design of Advanced Packaging & Systems Symposium, Seoul, Korea, Dec. 2015.
[61] Junsik Park, Jongsung Lee, Seongmoo Kim, Byongsu Seol, and Jingook Kim, “Fast Calculation of System-Level ESD Noise Coupling to a Microstrip Line Using PEEC Method”, 2015 IEEE Electrical Design of Advanced Packaging & Systems Symposium, Seoul, Korea, Dec. 2015.
[60] Junsik Park and Jingook Kim, “Calculation and Measurement of System-Level ESD Coupling”, 2015 Korea-Japan Joint Conference on EMT/EMC/BE, Sendai, Japan, Nov. 2015.
[59] Manho Lee, Heegon Kim, Sukjin Kim, Joungho Kim, Jonghyun Cho, Changwook Yoon, Brice Achkir, Jingook Kim, and Jun Fan, “Design of On-Chip Linear Voltage Regulator Module And Measurement of Power Distribution Network Noise Fluctuation at High-Speed Output Buffer” 2015 IEEE Conference on Electrical Performance of Electronic Packaging and Systems, Oct. 2015.
[58] Eunkyeong Park, Jongjoo Lee, Youngwoo Park, Jingook Kim, “Calculation of Power-Supply-Induced Jitter at a 3-D IC channel including ESD Protection Circuits”, 2015 Joint IEEE International Symposium on Electromagnetic Compatibility and EMC Europe, Dresden, Germany, Aug 16-22.
[57] Junsik Park, Jongsung Lee, Byongsu Seol, and Jingook Kim, “Calculation and Measurement of System Level ESD Coupling using PEEC method”, 2015 EOS/ESD Symposium for Factory Issues, Seoul, Korea, June 30 – July 1.
[56] Hyeuntae Cho, Jingook Kim, Jeehoon Jung, Katherine A. Kim, “Comparison of Input Power Factor Correction Techniques for Buck Converters in Single-Phase Wireless Power Transfer Systems”, 2015 IEEE PELS Workshop on Emerging Technologies: Wireless Power, Daejon, Korea, June 5-6.
[55] Mina Kim, Katherine A. Kim, Jingook Kim, and Jeehoon Jung, “Design Methodology of a 500 W Wireless Power Transfer Converter”, 2015 IEEE PELS Workshop on Emerging Technologies: Wireless Power, Daejon, Korea, June 5-6.
[54] Sangyeong Jeong, Jeehoon Jung, Katherine A. Kim, and Jingook Kim, “Analytical Investigation of Optimal Wireless Power Transfer Topology for Electric Vehicles”, 2015 IEEE PELS Workshop on Emerging Technologies: Wireless Power, Daejon, Korea, June 5-6.
[53] Jongwoo Jeong, Jingook Kim, No-Weon Kang, and Ki Jin Han, “‘Multi-Port Characterization of Vias Using Indirect Contact Probing Method”, 2015 Asia-Pacific Symposium on Electromagnetic Compatibility, Taipei, Taiwan, May 2015.
[52] Changwook Yoon, Sukjin Kim, Kiyeong Kim, Heegon Kim, Jingook Kim, Joungho Kim, and Jun Fan, “A Slope and Amplitude controllable Triangular-Current Generator for the Injection of a Broad-band PDN Noise”, 2015 IEEE International Symposium on Electromagnetic Compatibility in Santa Clara, March 2015.
[51] Heegon Kim, Sukjin Kim, Changwook Yoon, Jingook Kim, Brice Achkir, Joungho Kim, and Jun Fan, “On-Chip Linear Voltage Regulator Module (VRM) Effect on Power Distribution Network (PDN) Noise and Jitter at High-Speed Output Buffer “, 2015 IEEE International Symposium on Electromagnetic Compatibility in Santa Clara, March 2015. (Best Paper Award)
[50] Kiyeong Kim, Jingook Kim, Heegon Kim, Hyungsoo Kim, and Joungho Kim, “Analytical and statistical eye estimation in 2.5D and 3D ICs”, DesignCon 2015, Santa Clara, CA, Jan. 2015.
[49] Heegon Kim, Kiyeong Kim, Jingook Kim, Changwook Yoon, Hyungsoo Kim, and Joungho Kim, “Fast statistical eye-diagram estimation for high-speed channel including receiver circuit”, DesignCon 2015, Santa Clara, CA, Jan. 2015.
[48] Jongwoo Jeong, Jingook Kim, No-Weon Kang, and Ki Jin Han, “Indirect contact probing method for characterizing via arrays in electonic packaging”, 2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium, Bangalore, India, Dec. 2014.
[47] Jingook Kim, Eunkyeong Park, Jongjoo Lee, Kwangsoo Park, and Youngwoo Park, “Novel target impedance for power distribution network of simultaneous switching output (SSO) buffers”, 2014 IEEE Electrical Design of Advanced Packaging & Systems Symposium, Bangalore, India, Dec. 2014.
[46] Heegon Kim, Jingook Kim, Brice Achkir, Changwook Yoon, and Jun Fan, “On-Chip Voltage Regulator Module (VRM) Effect on PowerGround Noise and Jitter at High-Speed Output Buffer”, 2014 IEEE Symposium on Electromagnetic Compatibility, NC, USA, Aug 2014.
[45] Changwook Yoon, Tsiklauri Mikheil, Mikhail Zvonkin, Alex Razmadze, Aman Aflaki, Jingook Kim, Jun Fan, James Drewniak, Bill Chen, “Design Criteria of Automatic Fixture Removal (AFR) for Asymmetric Fixture De-embedding”, 2014 IEEE Symposium on Electromagnetic Compatibility, NC, USA, Aug 2014.
[44] Junsik Park, Jongsung Lee, Byongsu Seol, and Jingook Kim, “Efficient Calculation of ESD Inductive Coupling on a Conductor Loop Using PEEC Method”, 2014 IEEE Symposium on Electromagnetic Compatibility, NC, USA, Aug 2014.
[43] Eunkyeong Park, Hyungsoo Kim, Kwansu Shon, and Jingook Kim, “Analytical Jitter Estimation of Two-Stage Output Buffers with Supply Voltage Fluctuations”, 2014 IEEE Symposium on Electromagnetic Compatibility, NC, USA, Aug 2014.
[42] Dongil Shin, Sungnam Kim, Geunseok Jeong, Jaesu Park, Joungwook Park, Ki Jin Han, and Jingook Kim, “A common-Mode Active Filter in a Compact Package for a Switching Mode Power Supply”, 2014 IEEE Symposium on Electromagnetic Compatibility, NC, USA, Aug 2014.
[41] Sangyeong Jeong, Seungyoung Ahn, and Jingook Kim, “Spatial Visualization of Inductive Coupling Parameter for Optimization of Wireless Power Tranfer Coils”, IEEE Wireless Power Transfer Conference 2014, Jeju, Korea, May 2014.
[40] Kiyeong Kim, Jingook Kim, Heegon Kim, Junho Lee, Joungho Kim,”Worst case eye estimation method considering power noise on Tx output driver and channel crosstalk & ISI in interposer-based 2.5D interfaces”, DesignCon 2014, Santa Clara, CA, Jan. 2014.
[39] Jingook Kim, Eunkyeong Park, Jongjoo Lee, Kwangsoo Park, and Joonhee Lee,”Improved Statistical Link Path Analysis Considering Both Channel ISI and Supply Voltage Fluctuations”, DesignCon 2014, Santa Clara, CA, Jan. 2014. (Best Paper Award Finalist)
[38] Jingook Kim, Eunkyeong Park, Junho Lee, and Kwansu Shon, “Probability Density Calculation of Step Pulse Responses at a 3-D IC Channel with Supply Voltage Fluctuations”, 2013 IEEE Electrical Design of Advanced Packaging & Systems Symposium, Nara Japan, Dec. 2013.
[37] Jingook Kim and Franklin Bien, “‘Electric Field Coupling Technique of Wireless Power Transfer for Electric Vehicles”, IEEE 2013 Tencon-Spring, Sydney Australia, April 2013.
[36] Ketan Shringarpure, Siming Pan, Jingook Kim, Brice Achkir, Bruce Archambeault, Jun Fan, and James Drewniak, “Innovative PDN Design Guidelines for Practical High Layer-Count PCBs”, DesignCon 2013, Santa Clara, CA, Jan. 2013. (Best Paper Award Finalist)
[35] Jingook Kim, Dongil Shin, Junho Lee, Sunki Cho, Chulsoon Hwang, and Jun Fan, “Statistical BER Analysis due to Supply Voltage Fluctuations at a Single-Ended Buffer”, DesignCon 2013, Santa Clara, CA, Jan. 2013.
[34] Jingook Kim, Chulsoon Hwang, and Seungyoung Ahn, “Spatial Distribution of Mutual Inductance between Coils for Wireless Power Transfer”, in Proc. of 2012 Korea-Japan EMT/EMC/BE Joint Conference (KJJC-2012), May 18-19, 2012, Seoul, Korea.
[33] Jingook Kim, Soumya De, Ketan Shringarpure, Siming Pan, Brice Achkir, Jun Fan, and James L. Drewniak, “Analytical expressions for transfer function of supply voltage fluctuation to jitter at a single-ended buffer”, in Proc. of 2011 IEEE International Symposium on Electromagnetic Compatibility, Aug. 2011.
[32] Bruce Archambeault, Jingook Kim, Sam Connor, Jun Fan “Optimizing decoupling capacitor placement to reduce effective inductance”, in Proc. of 2011 IEEE International Symposium on Electromagnetic Compatibility, Aug. 2011.
[31] Liang Li, Jingook Kim, Hanfeng Wang, Songping Wu, Yuzo Takita, Hayato Takeuchi, Kenji Araki, Jun Fan, “Measurement of multiple switching current components through a bulk decoupling capacitor using a lab-made low-cost current probe”, in Proc. of 2011 IEEE International Symposium on Electromagnetic Compatibility, Aug. 2011.
[30] Tao Wang, Jingook Kim, Jun Fan, and Yiyu Shi, “Compressed sensing based analytical modeling for Through-Silicon-Via pairs”, in Proc. of The 54th International Midwest Symposium on Circuits and Systems, Aug. 2011.

—–  ICEMC Lab. Started ——

[29] Jingook Kim, James Drewniak, Jun Fan, “Power/ground pin-map design for power integrity”, in Proc. of the ASME 2011 Pacific Rim Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Systems, InterPACK2011, July 2011.
[28] Hanfeng Wang, Jingook Kim, Yiyu Shi, and Jun Fan, “The Effects of substrate doping density on the electrical performance of Through-Silicon-Via (TSV)”, in Proc. of 2011 Asia-Pacific Symposium on Electromagnetic Compatibilit., May 2011.
[27] Jingook Kim, Eakhwan Song, Jun Fan, Joungho Kim, and James L. Drewniak, “IC noise source for dynamic PDN assessment”, DesignCon 2011, Santa Clara, CA, Feb. 2011.
[26] Jingook Kim, Songping Wu, Hanfeng Wang, Yuzou Takita, Hayato Takeuchi, Kenji Araki, Gang Feng, and Jun Fan, “Improved target impedance and IC transient current measurement for power distributin network design”, in Proc. of 2010 IEEE International Symposium on Electromagnetic Compatibility, pp. 445-450, July. 2010. (Best Paper Award Finalist)
[25] Siming Pan, Jingook Kim, Sungnam Kim, Jaesu Park, Heoncheol Oh and Jun Fan, “An equivalent three-dipole model for IC radiated emissions based on TEM cell measurements”, in Proc. of 2010 IEEE International Symposium on Electromagnetic Compatibility, pp. 652-656, July. 2010. (Best Paper Award)
[24] Jingook Kim, Bruce Archambeault, James L. Knighten, and Jun Fan, “Analysis of mutual inductance effect between decoupling capacitors on planar power bus”, in Proc. of 2010 Asia-Pacific Symposium on Electromagnetic Compatibility, pp. 313-316, Apr. 2010.
[23] Tae-Young Oh, Young-Soo Sohn, Seung-Jun Bae, Min-Sang Park, Ji-Hoon Lim, Yong-Ki Cho, Dae-Hyun Kim, Dong-Min Kim, Hye-Ran Kim, Hyun-Joong Kim, Jin-Hyun Kim, Jin-Kook Kim, Young-Sik Kim, Byeong-Cheol Kim, Sang-Hyup Kwak, Jae-Hyung Lee, Jae-Young Lee, Chang-Ho Shin, Yun-Seok Yang, Beom-Sig Cho, Sam-Young Bang, Hyang-Ja Yang, Young-Ryeol Choi, Gil-Shin Moon, Cheol-Goo Park, Seok-Won Hwang, Jeong-Don Lim, Kwang-Il Park, Joo Sun Choi, Young-Hyun Jun, “A 7Gb/s/pin GDDR5 SDRAM with 2.5ns bank-to-bank active time and no bank-group restriction”, in Proc. of 2010 IEEE International Solid-State Circuits Conference (ISSCC), pp. 434-435, Feb. 2010.
[22] Samuel Conner, Liehui Ren, Jingook Kim, Bruce Archambeault, Jun Fan, James Drewniak, “Using the cavity resonance method for fast calculation of power plane impedance”, in Proc. of DesignCon 2010, Feb. 2010.
[21] Jingook Kim, Jaemin Kim, Liehui Ren, Jun Fan, Joungho Kim, and James L. Drewniak, “Extraction of equivalent inductance in package-PCB hierarchical power distribution network”, in Proc. of 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, pp 109-112, Oct. 2009.
[20] Liehui Ren, Jingook Kim, Gang Feng, Bruce Archambeault, James L. Knighten, James L. Drewniak, “Frequency-dependent via inductances for accurate power distribution network modeling”, in Proc. of 2009 IEEE International Symposium on Electromagnetic Compatibility, pp. 63-68, Aug. 2009.
[19] Seung-Jun Bae, Young-Soo Sohn, Kwang-il Park, Kyung-Ho Kim, Dae-Hyun Chung, Jin-Gook Kim, Si-Hong Kim, Min-Sang Park, Jae-Hyung Lee, Sam-Young Bang, Ho-Kyung Lee, In-Soo Park, Jae-Sung Kim, Dae-Hyun Kim, Hye-Ran Kim, Yong-Jae Shin, Cheol-Goo Park, Gil-Chin Moon, Ki-Woong Yeom, Kang-Young Kim, Jae-Young Lee, Hyang-Ja Yang, Seong-Jin Jang, Joo Sun Choi, Young-Hyun Jun, and Kinam Kim, “ A 60nm 6Gb/s/pin GDDR5 graphics DRAM with multifaceted clocking and ISI/SSN-reduction techniques”, in Proc. of 2008 IEEE International Solid-State Circuits Conference (ISSCC), pp. 278-279, 613, Feb. 2008.
[18] Eakhwan Song, Junho Lee, Jingook Kim, Dong Gun Kam, Chunghyun Ryu and Joungho Kim , “Estimation of data-dependent jitter using single pulse analysis method in high-speed differential signaling”, in Proc. of 1st Electronics Systemintegration Technology Conference, pp. 741-746, Sep. 2006.
[17] Jingook Kim, Jiwang Lee, Eakhwan Song, Jeonghyeon Jo, and Joungho Kim, “Compensation of undesired channel effects by frequency domain optimization of pre-emphasis filter for over Gbps signaling”, in Proc. of 2006 IEEE International Symposium on Electromagnetic Compatibility, pp. 721-726, Aug. 2006.
[16] Jingook Kim, Myunghee Sung, Jonghoon Kim, Eakhwan Song, Jaemin Kim, Byungse so, and Joungho Kim, “Design and analysis of improved multi-module memory bus using Wilkinson power divider”, in Proc. of 2006 IEEE International Symposium on Electromagnetic Compatibility, Aug. 2006.
[15] Eakhwan Song, Junho Lee, Jingook Kim, Dong Gun Kam, Chunghyun Ryu and Joungho Kim , “Data-dependent jitter estimation using single pulse analysis method”, in Proc. of IEEE 7th Electronics Packaging Technology Conference, pp. 810-813, Dec. 2005.
[14] Jingook Kim, Mihai Dragos Rotaru, Kok Chin Chong, Mahadevan K. Iyer, and Joungho Kim, “Via and reference discontinuity impact on high-speed signal integrity”, in Proc. of 2004 IEEE International Symposium on Electromagnetic Compatibility, pp. 583-587, Aug. 2004.
[13] Jingook Kim, Mihai Dragos Rotaru, Kok Chin Chong, Jongbae Park, Mahadevan K. Iyer, and Joungho Kim, “Coupling of simultaneous switching noise to interconnecting lines in high-speed systems”, in Proc. of IEEE 54th Electronic Components and Technology Conference, pp. 568-574, Jun. 2004.
[12] Jingook Kim, Mihai Dragos Rotaru, Junwoo Lee, Jongbae Park, Popov Alexander, Mahadevan K. Iyer, and Joungho Kim, “Analytical coupling model of SSN on power/ground planes to signal traces in high-speed multi-layer packages or boards,” in Proc. of IEEE 5th Electronics Packaging Technology Conference, pp. 45-50, Dec. 2003.
[11] Youchul Jeong, Hyungsoo Kim, Jingook Kim, Jongbae Park, and Joungho Kim, “ Analysis of power/ground network for mixed mode circuits in multi-layer PCB,” in Proc. of 2003 Asia-Pacific Microwave Conference, pp. 1324-1327, Nov. 2003.
[10] Youchul Jeong, Hyungsoo Kim, Jingook Kim, Jongbae Park, and Joungho Kim, “ Analysis of noise isolation methods on split power/ground plane of multi-layered package and PCB for low jitter mixed mode system,” in Proc. of IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, pp. 199-202, Oct. 2003.
[9] Jun So Pak, Jingook Kim, Heejae Lee, Jung-Gun Byun, and Joungho Kim, “Coupling of Through-hole signal via to power/ground plane resonance and excitation of edge radiation in multi-layer PCB,” in Proc. of 2003 IEEE International Symposium on Electromagnetic Compatibility, pp. 231 -235, Aug. 2003.
[8] Jingook Kim, Hyungsoo Kim, Youchul Jeong, and Joungho Kim, “Tapered slot shape on slotted reference plane of multi-layer PCB for reduction of crosstalk and radiated emission,” in Proc. of IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, pp. 275-278. Oct. 2002.
[7] Hyungsoo Kim, Jingook Kim, Youchul Jeong, Jongbae Park, and Joungho Kim, “Analysis of via distribution effect on multi-layered power/ground transfer impedance of high-performance packages,” in Proc. of IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, pp. 171-174, Oct. 2002.
[6] Youchul Jeong, Hyungsoo Kim, Jingook Kim, Jongbae Park, and Joungho Kim, “An efficient hybrid transmission line method (HTLM) for analysis of perforated package power/ground plane,” in Proc. of IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging, pp. 179-183, Oct. 2002.
[5] Youchul Jeong, Junwoo Lee, Jingook Kim, Suna Choi, Hyunho Park, Kyungho Kang, Heehwan Kim, Kiwoong Whang, and Joungho Kim, “Radiated emission from plasma display panel (PDP) depending on addressing line structure and current driving scheme,” in Proc. of IEEE 2002 International Symposium on Electromagnetic Compatibility, pp. 140-143, Aug. 2002.
[4] Jingook Kim, Hyungsoo Kim, Youchul Jeong, Junho Lee, and Joungho Kim, “Slot transmission line model of interconnections crossing split power/ground plane on high-speed multi-layer board,” in Proc. of IEEE 6th Workshop on Signal Propagation on Interconnects, pp. 23-26, May 2002.
[3] Jingook Kim, Junho Lee, Namhoon Kim, Junwoo Lee, H.Y.Bang, Y.H. Chung, and Joungho Kim, “ microwave frequency dielectric constant and loss tangent measurements of PCB materials using stripline structure”, in Proc. of International Conference on Advances in Packaing (APACK2001), Dec. 2001.
[2] Heeseok Lee, Hyungsoo Kim, Jingook Kim, You Chul Jeong and Joungho Kim, “ Equivalent circuit representation and dimensional reduction technique for efficient FDTD modeling of power/ground plane”, in Proc. of IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging, pp. 145-148, Oct. 2001.
[1] Joungho Kim, Hyungsoo Kim, Heeseok Lee, Jonghoon Kim, Jinkook Kim, “ Effect of power/ground partitioning and stitching capacitor placement on signal integrity and EMI of multi-layer and multi-power system,” in Proc. of InterPACK2001, July 2001.